Development of Barium Titanate Single Layer Thin Film Capacitors

Presenter Information

Kyle Borgmann

Department

Materials Science and Engineering

Major

Metallurgical Engineering

Research Advisor

Huebner, Wayne
O'Keefe, Matthew

Advisor's Department

Materials Science and Engineering

Funding Source

Sandia/KCP Honeywell Plant

Abstract

Discrete electrical components such as capacitors, resistors, resonators, and inductors are still soldered onto the surfaces. The next generation of technology will be to integrate these components into or onto a low temperature co-fired ceramic substrate (LTCC).

The objective of this work is to develop thin film sputtering techniques that will yield single layer capacitors directly on top of a LTCC substrate. It is desirable to minimize the size of the capacitor by increasing the K or decreasing the thickness. At the same time the dielectric must have a high insulation resistance.

The capacitors were made from 50 nm nickel electrodes and a 300nm BaTiO3 dielectric. A physical mask of 74um x 74 um was used to increase the number of viable test points. The yield for positive test points was approximately 61%. A positive test point has a high resistance, approximately 109-10Ω.

Biography

Kyle Borgmann is a senior in the Metallurgical Engineering department and was born in Washington, MO. He attended East Central College for three years before transferring to Missouri S&T in 2006. He has had several internships ranging from working in a copper mine in Tucson, AZ to a stainless steel foundry in Pevely, MO. He will be graduating in May, 2009.

Research Category

Engineering

Presentation Type

Poster Presentation

Document Type

Poster

Location

Upper Atrium/Hallway

Presentation Date

08 Apr 2009, 1:00 pm - 3:00 pm

Comments

Joint project with Abbe Deoring and Roger Rettig

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Apr 8th, 1:00 PM Apr 8th, 3:00 PM

Development of Barium Titanate Single Layer Thin Film Capacitors

Upper Atrium/Hallway

Discrete electrical components such as capacitors, resistors, resonators, and inductors are still soldered onto the surfaces. The next generation of technology will be to integrate these components into or onto a low temperature co-fired ceramic substrate (LTCC).

The objective of this work is to develop thin film sputtering techniques that will yield single layer capacitors directly on top of a LTCC substrate. It is desirable to minimize the size of the capacitor by increasing the K or decreasing the thickness. At the same time the dielectric must have a high insulation resistance.

The capacitors were made from 50 nm nickel electrodes and a 300nm BaTiO3 dielectric. A physical mask of 74um x 74 um was used to increase the number of viable test points. The yield for positive test points was approximately 61%. A positive test point has a high resistance, approximately 109-10Ω.