Effect of Interfacial Atomic Mixing on the Thermal Conductivity of Multi-Layered Stacking Structure
Abstract
Multi-layered stacking structures and atomic mixing interfaces were constructed. The effects of various factors on the thermal conductivity of different lattice structures were studied by non-equilibrium molecular dynamics simulations, including the number of atomic mixing layers, temperature, total length of the system, and period length. The results showed that the mixing of two and four layers of atoms can improve the thermal conductivities of the multi-layer structure with a small total length due to a phonon "bridge"mechanism. When the total length of the system is large, the thermal conductivity of the multi-layer structure with atomic mixing interfaces decreases significantly compared with that of the perfect interfaces. The interfacial atom mixing destroys the phonon coherent transport in the multi-layer structure and decreases the thermal conductivity to some extent. The thermal conductivity of the multi-layer structure with perfect interfaces is significantly affected by temperature, whereas the thermal conductivity of the multi-layer structures with atomic mixing is less sensitive to temperature.
Recommended Citation
Y. Liu et al., "Effect of Interfacial Atomic Mixing on the Thermal Conductivity of Multi-Layered Stacking Structure," Journal of Applied Physics, vol. 131, no. 6, article no. 64301, AIP Publishing, Feb 2022.
The definitive version is available at https://doi.org/10.1063/5.0078669
Department(s)
Physics
International Standard Serial Number (ISSN)
1089-7550; 0021-8979
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2022 Author(s). Published under an exclusive license by AIP Publishing.
Publication Date
14 Feb 2022
Comments
The authors are grateful for funding from the National Natural Science Foundation of China (NNSFC) (No. 52076080), the Natural Science Foundation of Hebei Province (No. E2020502011), and the Fundamental Research Funds for the Central Universities (No. 2020MS105).