Abstract

Translating the ultrahigh intrinsic conductivity of conjugated polymers into bulk 3D architectures remains a formidable challenge due to the fundamental dichotomy between rheological printability and electronic purity. Existing strategies necessitate a compromise: solution-processing requires insulating binders that degrade charge transport, while binder-free vapor-phase polymerization (VPP) is kinetically confined to surface-limited thin films by diffusion constraints. Here, we introduce atomized oxidative polymerization (AOP), a manufacturing paradigm that overcomes these kinetic barriers via active, layer-by-layer monomer atomization. This approach ensures stoichiometric reaction conditions throughout the printed volume, driving a structural transition toward highly conductive quinoid-dominant chains with enhanced π-π stacking. The resulting binder-free poly(3,4-ethylenedioxythiophene) (PEDOT) structures achieve bulk conductivities exceeding 950 S/cm and superior mechanical stiffness, while uniquely exhibiting suppressed thermal transport characteristic of a phonon glass, effectively decoupling electrical and thermal transport. AOP establishes a generalizable platform for fabricating dense, insoluble conjugated polymer architectures for advanced applications, including high-efficiency organic thermoelectrics, thermally stable biointerfaces, and energy storage devices, without the limitations of traditional solution or vapor-phase processing.

Department(s)

Mechanical and Aerospace Engineering

Publication Status

Open Access

Keywords and Phrases

3D printing; additive fabrication; bulk structures; conductive polymers; PEDOT

International Standard Serial Number (ISSN)

1616-3028; 1616-301X

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2026 Wiley; Wiley-VCH Verlag, All rights reserved.

Creative Commons Licensing

Creative Commons License
This work is licensed under a Creative Commons Attribution-Noncommercial-No Derivative Works 4.0 License.

Publication Date

01 Jan 2026

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