Effects of Heat Treatment on Ti–ni–cu/tini Shape Memory Bimetal Fabricated by Directed Energy Deposition
Abstract
A Ti–Ni–Cu/TiNi bi-metallic shape memory alloy structure was fabricated via laser directed energy deposition with powder blend of Ti, Ni, and Cu elemental powders. Subsequently, part of the as-deposited bi-metallic shape memory alloy underwent heat treatment at 400 °C and 600 °C. Microstructural, mechanical, and functional properties of the bi-metallic structure in its as-deposited state and after both heat treatment states were characterized across various locations to investigate variations in multifunctional features and shape memory behaviors. Microstructural analysis revealed that the Ti-rich Ti–Ni–Cu ternary alloy section exhibited no obvious change among different heat treatment conditions. On the contrary, within the TiNi substrate, the laser-induced heat during the deposition process created location-dependent microstructural features and properties, and subsequent heat treatments further diversified the mechanical and thermal behaviors and yielded a broader range of behavior combinations. This work demonstrates the potential of combining directed energy deposition with heat treatment to develop multi-sectional shape memory alloys with greater flexibility, lower cost, and a wider range of memory effect combinations.
Recommended Citation
Y. Chen and F. Liou, "Effects of Heat Treatment on Ti–ni–cu/tini Shape Memory Bimetal Fabricated by Directed Energy Deposition," Materials Characterization, vol. 230, article no. 115792, Elsevier, Dec 2025.
The definitive version is available at https://doi.org/10.1016/j.matchar.2025.115792
Department(s)
Mechanical and Aerospace Engineering
Keywords and Phrases
Additive manufacturing; Bi-metallic structure; Directed energy deposition; Multifunctional materials; Shape memory alloy
International Standard Serial Number (ISSN)
1044-5803
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2025 Elsevier, All rights reserved.
Publication Date
01 Dec 2025

Comments
Intelligent Systems Center, Grant CMMI 1625736