Abstract
The development of Industry 4.0 has accelerated the adoption of sophisticated technologies, including Digital Twins (DTs), Artificial Intelligence (AI), and cybersecurity, within Additive Manufacturing (AM). Enabling real-time monitoring, process optimization, predictive maintenance, and secure data management can redefine conventional manufacturing paradigms. Although their individual importance is increasing, a consistent understanding of how these technologies interact and collectively improve AM procedures is lacking. Focusing on the integration of digital twins (DTs), modular AI, and cybersecurity in AM, this review presents a comprehensive analysis of over 137 research publications from Scopus, Web of Science, Google Scholar, and ResearchGate. The publications are categorized into three thematic groups, followed by an analysis of key findings. Finally, the study identifies research gaps and proposes detailed recommendations along with a framework for future research. The study reveals that traditional AM processes have undergone significant transformations driven by digital threads, digital threads (DTs), and AI. However, this digitalization introduces vulnerabilities, leaving AM systems prone to cyber-physical attacks. Emerging advancements in AI, Machine Learning (ML), and Blockchain present promising solutions to mitigate these challenges. This paper is among the first to comprehensively summarize and evaluate the advancements in AM, emphasizing the integration of DTs, Modular AI, and cybersecurity strategies.
Recommended Citation
M. S. Ahmmed et al., "Digital Twins, AI, and Cybersecurity in Additive Manufacturing: A Comprehensive Review of Current Trends and Challenges," Machines, vol. 13, no. 8, article no. 691, MDPI, Aug 2025.
The definitive version is available at https://doi.org/10.3390/machines13080691
Department(s)
Mechanical and Aerospace Engineering
Publication Status
Open Access
Keywords and Phrases
additive manufacturing; artificial intelligence; cybersecurity; blockchain; digital twin
International Standard Serial Number (ISSN)
2075-1702
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2025 The Authors, All rights reserved.
Creative Commons Licensing

This work is licensed under a Creative Commons Attribution 4.0 License.
Publication Date
01 Aug 2025

Comments
National Science Foundation, Grant EEC 1937128