Extrinsic Toughening in Bonded Joints with Hybrid Thermoset–thermoplastic Bondline: Experimental Evidence and Modeling Strategy
Abstract
Adhesive bonded composite joints with an embedded insert consisting of an interfacial hybrid thermoset–thermoplastic bondline could activate an extrinsic toughening mechanism that quadruples the mode I fracture toughness. However, the mechanisms of extrinsic toughening (anchoring, debonding, stretching, detachment), their associated energy dissipation, and the role of bondline parameters (wavelength, porosity, ductility) have not been detailed thus far. Here, we developed double cantilever beam (DCB) finite element models consisting of two rigid composite adherends and an elastoplastic bondline. We prescribed a spatially arranged interfacial/cohesive pattern to simulate the extrinsic toughening and evaluate the increase in fracture toughness. DCB tests were performed to validate the load–displacement curves, fracture toughness, and extrinsic toughening mechanisms obtained from the finite element models. The elastic–plastic energy dissipation during the crack-bridging process was also evaluated using the models. Despite the two-dimensional nature, the modeling results are in reasonable agreement with the experiments, providing an option for further developing a new heterogeneous bondline concept.
Recommended Citation
A. S. Perdana et al., "Extrinsic Toughening in Bonded Joints with Hybrid Thermoset–thermoplastic Bondline: Experimental Evidence and Modeling Strategy," Composites Part A Applied Science and Manufacturing, vol. 190, article no. 108686, Elsevier, Mar 2025.
The definitive version is available at https://doi.org/10.1016/j.compositesa.2024.108686
Department(s)
Mechanical and Aerospace Engineering
Keywords and Phrases
Composite bonded joints; Energy release rate; Finite element; Mode-I fracture
International Standard Serial Number (ISSN)
1359-835X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2025 Elsevier, All rights reserved.
Publication Date
01 Mar 2025

Comments
Institut Teknologi Bandung, Grant OSR CRG2017-3388