Toughening Adhesive Joints through Crack Path Engineering using Integrated Polyamide Wires
Abstract
Ensuring the progressivity of failure of adhesively-bonded composite joints is necessary to guarantee safety and to optimize maintenance operations. In our previous work, we proposed a novel surface patterning strategy to stop crack propagation by triggering bridging of adhesive ligaments. However, the brittle failure of classical bridging ligaments still releases a large amount of stored elastic energy, leading to a snap-slip crack propagation or even catastrophic sudden fracture of bonded joints. Such technology could be further improved by integrating ductile structures within the adhesive layer, but the detailed failure mechanisms require systematic investigation. In this work, we integrated thermoplastic polyamide structures within the epoxy adhesive layer of double cantilever beams to guide this transition from brittle failure to a stable softening behavior. Weak polyamide/epoxy adhesion and their embedded area fractions were critical since they affected the damage mechanisms and determined energy dissipation within bonded joints.
Recommended Citation
R. Tao et al., "Toughening Adhesive Joints through Crack Path Engineering using Integrated Polyamide Wires," Composites Part A Applied Science and Manufacturing, vol. 158, article no. 106954, Elsevier, Jul 2022.
The definitive version is available at https://doi.org/10.1016/j.compositesa.2022.106954
Department(s)
Mechanical and Aerospace Engineering
Keywords and Phrases
Adhesive joints; CFRP; DCB; Extrinsic toughening; Polyamide inclusions
International Standard Serial Number (ISSN)
1359-835X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2025 Elsevier, All rights reserved.
Publication Date
01 Jul 2022

Comments
King Abdullah University of Science and Technology, Grant OSR-2017-CRG6-3388.01