Abstract

Producing lightweight structures can be effectively achieved using adhesive bonding that incorporates a high-performance adhesive, eliminating the mechanical joints (rivet, bolts). Here, the proof-of-concept of tailoring the high-performance adhesive using microstructures exhibiting a negative Poisson's ratio (auxetic) is investigated using two single lap joint (SLJ) models developed in ABAQUS/Standard. The SLJ models consist of two rigid adherends that are bonded using either homogeneous or heterogeneous adhesive that produces auxetic response. In homogeneous adhesive, a negative value of Poisson's ratio is defined in the adhesive part of the models. In heterogeneous adhesive, the negative Poisson's ratio is obtained by explicitly building orthogonally arranged elliptical voids in the adhesive part of the models. In addition, the adherend-adhesive interface is represented by cohesive elements with bi-linear traction-separation rule. The effects of using two different adhesive models and thickness on peel and shear stresses, as well as failure mechanism and joint strength, are evaluated. We found that the effect of auxetic adhesive on SLJ response is more profound in the model using heterogeneous adhesive rather than the homogeneous one, where the joint strength enhancement could achieve 45 % in reference to the baseline model. The heterogeneous adhesive embedded between adherends is able to activate ligaments, the mechanism that could not be obtained using merely homogeneous adhesive. Our proposed modeling strategy can be a starting point to further the modeling approach of bonded joints utilizing auxetic adhesive.

Department(s)

Mechanical and Aerospace Engineering

Publication Status

Open Access

Comments

Institut Teknologi Bandung, Grant None

Keywords and Phrases

Adhesive; Auxetic; Bonded joint; Finite element model

International Standard Serial Number (ISSN)

2405-8440

Document Type

Article - Journal

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2025 Elsevier, All rights reserved.

Creative Commons Licensing

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

Publication Date

30 Jan 2024

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