The Influence of Residual Stress on Micromachine Stiction
Abstract
Adhesion plays an important role in microelectromechanical systems (MEMS). It is a major concern in MEMS reliability and oftentimes excessive adhesion forces lead to permanent adherence of MEMS surfaces resulting in microdevice failure. the role of residual stresses in the adhesive contact between a pre-stressed membrane and a rigid flat-ended cylindrical punch is studied. Breaking the contact can be achieved under either fixed-load or fixed-grips configuration. the influence of the residual stress on the pull-off force, punch displacement, and contact area at pull-off is studied. It is shown that residual stresses have significant influence on interfacial contact behavior in MEMS and, hence, should be taken into consideration in formulating the adhesion contact mechanics. Copyright © 2004 by ASME.
Recommended Citation
K. Wan and L. Kogut, "The Influence of Residual Stress on Micromachine Stiction," Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2004, no. PART A, pp. 17 - 21, article no. TRIB2004-64333, American Society of Mechanical Engineers, Jan 2004.
The definitive version is available at https://doi.org/10.1115/trib2004-64333
Department(s)
Mechanical and Aerospace Engineering
International Standard Book Number (ISBN)
978-079184181-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 American Society of Mechanical Engineers, All rights reserved.
Publication Date
01 Jan 2004
