Recommended Citation
K. Wan and G. Duan, "Response to "Comment on 'Adhesion-Delamination Mechanics of a Presented Rectangular Film Adhered Onto a Rigid Substrate' [J. Appl. Phys. 101, 024903 (2007)]"," Journal of Applied Physics, vol. 102, no. 2, article no. 026107, American Institute of Physics, Aug 2007.
The definitive version is available at https://doi.org/10.1063/1.2759208
Department(s)
Mechanical and Aerospace Engineering
Publication Status
Available Access
International Standard Serial Number (ISSN)
0021-8979
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2024 American Institute of Physics, All rights reserved.
Publication Date
08 Aug 2007
