Experimental Evaluation of the Probe Test for Measuring Thin Film Adhesion
Abstract
A probe test is proposed to quantify the adhesion of thin films and coatings. using a micromanipulator, a tungsten probe is advanced into the edge of a polymeric coating. Debonds initiate at the loading point and propagate into semicircular cracks at the interface as the probe slides under the coating. the size of the debond is related to the interfacial fracture energy; poorer adhesion results in larger debonds for a given probe displacement. Approximate closed-form and finite element analyses of the geometry have been conducted, along with a significant number of experiments on as-produced and environmentally-conditioned specimens. the technique is showing considerable promise for characterizing coating adhesion, and has certain advantages over existing techniques for certain applications.
Recommended Citation
D. A. Dillard et al., "Experimental Evaluation of the Probe Test for Measuring Thin Film Adhesion," American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, vol. 3, pp. 51 - 56, American Society of Mechanical Engineers, Jan 2003.
The definitive version is available at https://doi.org/10.1115/IMECE2003-43910
Department(s)
Mechanical and Aerospace Engineering
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 American Society of Mechanical Engineers, All rights reserved.
Publication Date
01 Jan 2003
