Adhesion of a Flat Punch Adhered to a Thin Pre-Stressed Membrane

Author

Kai Tak Wan, Missouri University of Science and Technology
David A. Dillard

Abstract

The mechanics of a circular membrane delaminating from a rigid punch is derived based on linear elasticity and an energy balance approach. Both the tensile prestress and the resulting concomitant stress upon external loading are considered. a "pull-off" phenomenon is predicted when the contact circle shrinks to a critical value between 0.1945 and 0.3679 of the film diameter, depending on the critical strain energy release rate and the prestress. These asymptotic limits match exactly with the prestress dominant model by Shanahan and prestress free model by Wan. Thin film delamination from a rectangular punch is also investigated. Unlike the circular punch, the rectangular contact is expected to reduce to a line contact with zero contact area at "pinch-off." the graphs and trends shown are useful in assessing thin film delamination assisted by a prestress.

Recommended Citation

K. T. Wan and D. A. Dillard, "Adhesion of a Flat Punch Adhered to a Thin Pre-Stressed Membrane," Journal of Adhesion, vol. 79, no. 2, pp. 123 - 140, Taylor and Francis Group; Taylor and Francis, Aug 2003.

The definitive version is available at https://doi.org/10.1080/00218460309573

Department(s)

Mechanical and Aerospace Engineering

Comments

National Science Foundation, Grant CMS-9713949

Keywords and Phrases

Adhesion; Delamination; Membrane; Punch; Residual stress

International Standard Serial Number (ISSN)

0021-8464

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Taylor and Francis Group; Taylor and Francis, All rights reserved.

Publication Date

22 Aug 2003