Abstract

Adhesion of a pre-stressed silicone rubber film to a planar graphite surface was investigated by a new cylindrical punch method. a homemade apparatus was constructed to meet force and displacement resolutions of 0.1 μN and 10 nm. When the punch approached the intersurface force range across the punch-film gap, the film jumped into contact at "pull-in". Upon unloading, once the tensile load reached a threshold, a spontaneous delamination occurred at "pull-off" with a non-zero contact circle. a theoretical model was constructed based a simple energy balance. the new method can be used to characterize an adhesion interface between a pre-stressed free-hanging film and a rigid substrate. © 2006 Elsevier Ltd. All rights reserved.

Department(s)

Mechanical and Aerospace Engineering

Comments

National Science Foundation, Grant 0757140

Keywords and Phrases

Adhesion; Contact mechanics; Delamination; Interface; Surface forces; Thin film

International Standard Serial Number (ISSN)

0013-7944

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Elsevier, All rights reserved.

Publication Date

01 May 2007

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