Recommended Citation
K. C. Chung et al., "Thermal Contact Conductance of Ceramic Substrate Junctions," Journal of Heat Transfer, vol. 117, no. 2, pp. 508 - 510, American Society of Mechanical Engineers, Jan 1995.
The definitive version is available at https://doi.org/10.1115/1.2822552
Department(s)
Mechanical and Aerospace Engineering
Publication Status
Available Access
Keywords and Phrases
Conduction; Thermal Packaging
International Standard Serial Number (ISSN)
1528-8943; 0022-1481
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 American Society of Mechanical Engineers, All rights reserved.
Publication Date
01 Jan 1995
