Thermal Contact Conductance Of Coated Junctions Within Microelectronic Packages

Author

Kee Chiang Chung
Heather K. Benson
John W. Sheffield, Missouri University of Science and TechnologyFollow

Abstract

There are inevitably mechanical or metallurgical joints between the integrated circuit chips and heat sinks in microelectronic packages. This paper discusses the role of the thermal contact conductance of metal and coating ceramic substrate interfaces within microelectronic packages. Two different surface roughness contacts are evaluated using four different coatings of the ceramic substrate. A comparison of the experimental data with an existing analytical model is presented.

Recommended Citation

K. C. Chung et al., "Thermal Contact Conductance Of Coated Junctions Within Microelectronic Packages," AIAA 28th Thermophysics Conference, 1993, article no. AIAA 93-2774, American Institute of Aeronautics and Astronautics, Jan 1993.

The definitive version is available at https://doi.org/10.2514/6.1993-2774

Department(s)

Mechanical and Aerospace Engineering

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2023 American Institute of Aeronautics and Astronautics, All rights reserved.

Publication Date

01 Jan 1993