Laser Induced Metallization on Flexible Polymer Coating: Analysis and Application
Alternative Title
Laser Induced Metallization for 3D Molded Interconnect Devices: Analysis and Application on Flexible Polymer Coating
Abstract
This paper describes the evaluation of an advanced substrate designed with a newly developed flexible polymeric material by spray coating, for use in an innovative additive laser structuring process, called Laser Induced Metallization (LIM). The evaluation was conducted by studying the feasibility to produce components with the LIM process and the relationship between the laser processing parameters and the copper thickness obtained after the electroless plating. The flexible polymeric material exhibited a positive response to the LIM process, allowing the process to achieve promising results in terms of copper thickness, electric resistance, and the mechanical properties of the polymeric material after the laser structuring. However, the workable range of the laser processing parameters is narrow. An experimental study was performed, where the LIM process was used to fabricate conductors for measuring resistance and capacitance variations in electric circuits for the creation of an insole sensor that can be used to monitor the behavior of a human foot under walking or other gaiting loads.
Recommended Citation
H. Y. Tsai et al., "Laser Induced Metallization on Flexible Polymer Coating: Analysis and Application," Journal of Materials Processing Technology, vol. 290, article no. 116986, Elsevier, Apr 2021.
The definitive version is available at https://doi.org/10.1016/j.jmatprotec.2020.116986
Department(s)
Mechanical and Aerospace Engineering
Research Center/Lab(s)
Intelligent Systems Center
Keywords and Phrases
Laser; Polymer; Structuring
International Standard Serial Number (ISSN)
0924-0136
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2021 Elsevier, All rights reserved.
Publication Date
01 Apr 2021
Comments
Ministry of Science and Technology, Taiwan, Grant 108-2221-E-007 -082 -MY3