Abstract

Embodiments of substrate support rings providing more uniform thickness of layers deposited or grown on a substrate are provided herein. In some embodiments, a substrate support ring includes: an inner ring with a centrally located support surface to support a substrate; and an outer ring extending radially outward from the support surface, wherein the outer ring comprises a reaction surface area disposed above and generally parallel to a support plane of the support surface, and wherein the reaction surface extends beyond the support surface by about 24 mm to about 45 mm.

Department(s)

Mechanical and Aerospace Engineering

Research Center/Lab(s)

Intelligent Systems Center

Patent Application Number

US14/315,794

Patent Number

US10211046B2

Document Type

Patent

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2019 Applied Materials, Inc., All rights reserved.

Publication Date

19 Feb 2019

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