Abstract
Embodiments of substrate support rings providing more uniform thickness of layers deposited or grown on a substrate are provided herein. In some embodiments, a substrate support ring includes: an inner ring with a centrally located support surface to support a substrate; and an outer ring extending radially outward from the support surface, wherein the outer ring comprises a reaction surface area disposed above and generally parallel to a support plane of the support surface, and wherein the reaction surface extends beyond the support surface by about 24 mm to about 45 mm.
Recommended Citation
H. Pan et al., "Substrate Support Ring for More Uniform Layer Thickness," U.S. Patents, Feb 2019.
Department(s)
Mechanical and Aerospace Engineering
Research Center/Lab(s)
Intelligent Systems Center
Second Research Center/Lab
Center for High Performance Computing Research
Patent Application Number
US14/315,794
Patent Number
US10211046B2
Document Type
Patent
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2019 Applied Materials, Inc., All rights reserved.
Publication Date
19 Feb 2019
