Design of Lattice Structure for Additive Manufacturing
Abstract
Additive Manufacturing (AM) technology provides new opportunities to automatically and flexibly fabricate parts with complicated shapes and architectures that could not be produced by conventional manufacturing processes, thus enabling unprecedented design flexibilities and application opportunities. The lattice structure possesses many superior properties to solid material and conventional structures. It is able to integrate more than one function into a physical part, which makes it attractive to a wide range of applications. With AM technology the lattice structure can be fabricated by adding material layer-by-layer directly from a Computer-Aided Design (CAD) model, rather than the conventional processes with complicated procedures. AM lattice structures have been intensively studied for more than ten years with significant progress having been made. This paper reviews and discusses AM processes, design methods and considerations, mechanical behavior, and applications for lattice structures enabled by this emerging technology.
Recommended Citation
W. Tao and M. Leu, "Design of Lattice Structure for Additive Manufacturing," Proceedings of the 2016 International Symposium on Flexible Automation (2016, Cleveland, OH), pp. 325 - 332, Institute of Electrical and Electronics Engineers (IEEE), Aug 2016.
The definitive version is available at https://doi.org/10.1109/ISFA.2016.7790182
Meeting Name
2016 International Symposium on Flexible Automation, ISFA 2016 (2016: Aug. 1-3, Cleveland, OH)
Department(s)
Mechanical and Aerospace Engineering
Research Center/Lab(s)
Intelligent Systems Center
Keywords and Phrases
3D printers; Computer aided design; Deposition; Manufacture; Complicated shape; Computer aided design models; Conventional manufacturing; Conventional structures; Design flexibility; Emerging technologies; Lattice structures; Mechanical behavior; Structural design
International Standard Book Number (ISBN)
978-1-5090-3467-3
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2016