Surface Roughness Optimization in Processing SiC Monocrystal Wafers by Wire Saw Machining with Ultrasonic Vibration
Recommended Citation
B. Wan et al., "Surface Roughness Optimization in Processing SiC Monocrystal Wafers by Wire Saw Machining with Ultrasonic Vibration," Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, vol. 228, no. 5, pp. 725 - 739, SAGE Publications, May 2014.
The definitive version is available at https://doi.org/10.1177/0954405413508116
Department(s)
Mechanical and Aerospace Engineering
International Standard Serial Number (ISSN)
0954-4054
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 SAGE Publications, All rights reserved.
Publication Date
01 May 2014
