Biodegradable Materials for Multilayer Transient Printed Circuit Boards
Recommended Citation
X. Huang et al., "Biodegradable Materials for Multilayer Transient Printed Circuit Boards," Advanced Materials, vol. 26, no. 43, pp. 7371 - 7377, Wiley-Blackwell, Nov 2014.
The definitive version is available at https://doi.org/10.1002/adma.201403164
Department(s)
Mechanical and Aerospace Engineering
International Standard Serial Number (ISSN)
0935-9648
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 Wiley-Blackwell, All rights reserved.
Publication Date
01 Nov 2014
PubMed ID
25244671
