Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining with Application to SiC Monocrystal Wafer Processing
Recommended Citation
S. Li et al., "Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining with Application to SiC Monocrystal Wafer Processing," Journal of Manufacturing Science and Engineering, vol. 139, no. 4, American Society of Mechanical Engineers (ASME), Apr 2017.
The definitive version is available at https://doi.org/10.1115/1.4034792
Department(s)
Mechanical and Aerospace Engineering
International Standard Serial Number (ISSN)
1087-1357
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 American Society of Mechanical Engineers (ASME), All rights reserved.
Publication Date
01 Apr 2017
