The Effects of Selected Impurities on the Electrocrystallization of Zinc

Abstract

Low levels of nickel, glue, and antimony, additions to acid sulfate electrolyte affect the corrosion of zinc during electrodeposition. Kinetic data and deposit morphology were obtained using cyclic voltammetric techniques in conjunction with scanning electron microscopy (SEM). The resulting data support a diffusion controlled codeposition from acid sulfate electrolyte of low levels of nickel with zinc. Local cell corrosion of zinc via the cathodic action of nickel sites is evidenced by severe pitting of the zinc crystallites. Glue is beneficial in offsetting the deleterious effects of nickel.

Meeting Name

Electrochemical Society Extended Abstracts (1985, Las Vegas, NV, USA)

Department(s)

Materials Science and Engineering

Second Department

Chemistry

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1985 The Electrochemical Society (ECS), All rights reserved.

Publication Date

01 Jan 1985

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