Optimization of Cu Seed Deposition from Organic Solution on TaSiN Barrier Layers using Design of Experiment (DOE) Methods

Abstract

The conditions for copper particle deposition on TaSiN barrier layers were optimized using design of experiments (DOE) methods. Copper particles were deposited spontaneously from an organic immersion bath for subsequent electroless copper deposition. Seeding time, copper concentration and organic additive concentration were selected as the main factors for a two-level full factorial experiment, augmented with center points. the total coverage by copper particles, median particle size and the standard deviation of the particle size were used as the responses. Statistical methods were used to estimate the effects of these factors and their interactions on the responses, and to identify optimal seeding conditions. a high density, uniform copper crystallite seed layer was deposited using the predicted optimal seeding conditions, and a smooth, shiny, adherent electroless copper film was readily obtained on the seed-activated layer.

Department(s)

Materials Science and Engineering

Second Department

Mathematics and Statistics

Keywords and Phrases

Copper particle deposition; Copper seed deposition; Preparation for electroless deposition; TaSiN barrier layers

International Standard Serial Number (ISSN)

0360-3164

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 The National Association for Surface Finishing (NASF), All rights reserved.

Publication Date

01 Apr 2009

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