Kinetic Analysis of the Thermal Degradation of Printed Wiring Boards

Author

Alex Luyima
Lifeng Zhang, Missouri University of Science and TechnologyFollow
Lucas Nana Wiredu Damoah

Abstract

The non-isothermal pyrolysis of printed wiring boards (PWBs) was investigated by simultaneous thermogravimetric and differential thermal analysis (TG-DTA) in the temperature range of 300-1200 K. Pyrolysis experiments were carried out on PWBs samples at three different heating rates of 10, 20, and 30°C/min. in this study, the kinetic parameters of PWBs pyrolysis have been estimated using model free and model fitted methods. © 2011 TMS.

Recommended Citation

A. Luyima et al., "Kinetic Analysis of the Thermal Degradation of Printed Wiring Boards," JOM, vol. 63, no. 8, pp. 33 - 37, Springer; Minerals, Metals and Materials Society (TMS), Aug 2011.

The definitive version is available at https://doi.org/10.1007/s11837-011-0134-y

Department(s)

Materials Science and Engineering

Comments

National Science Foundation, Grant CBET-0853458

International Standard Serial Number (ISSN)

1543-1851; 1047-4838

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Springer; Minerals, Metals and Materials Society (TMS), All rights reserved.

Publication Date

01 Aug 2011