Spontaneous Electrochemical Deposition of Gold Coatings from Organic Solutions

Abstract

Thin gold films less than 100 nm thick were deposited onto copper and nickel substrates using a unique immersion gold plating bath. the plating bath was prepared with poor-electrically conductive organic solvents that are typically used in the metal recovery industries. These solvents are commonly used for concentrating both base metals and precious metals by extracting them from aqueous solutions. Although the gold films deposited in this study were thin, they were continuous, free of pores, smooth, bright, and adherent. Scanning electron microscopy and x-ray diffraction showed the films were composed of nanometer-sized crystalline gold particles. X-ray photoelectron spectroscopy was used to confirm that the films consisted of metallic gold. Additionally, cross-sectional transmission electron microscopy was used to measure the thickness of a gold coating deposited on a copper substrate and to investigate the film/substrate interface. a deposition mechanism that is similar in nature to an aqueous immersion plating processed is proposed.

Department(s)

Materials Science and Engineering

International Standard Serial Number (ISSN)

0360-3164

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 National Association for Surface Finishing, All rights reserved.

Publication Date

01 Jan 2005

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