Aerospace Rework in a Lead-Free World
Abstract
The challenges faced by the aerospace electronics assemblies, especially in military applications, as the electronics industry incorporates lead-free (LF) materials are discussed. Aerospace prime contractors will be forced to use products that contain LF solder alloys in military or commercial aircraft, whether required to do so by environmental legislation or not. Aerospace electronics, both commercial and military, differ from consumer electronics in that rework and repair in the field are critical to maintaining operational aircraft. with LF becoming increasing widespread, the rework and repair issues concerning long-term reliability of electronics assemblies must include the possibility of mixing LF and SnPb solder alloys in the assembly.
Recommended Citation
M. O'Keefe and R. Colfax, "Aerospace Rework in a Lead-Free World," Assembly, vol. 48, no. 6, pp. 36 - 42, BNP Media, Jun 2005.
Department(s)
Materials Science and Engineering
International Standard Serial Number (ISSN)
1050-8171
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 BNP Media, All rights reserved.
Publication Date
01 Jun 2005