Growth of Electrolytic Copper Dendrites and their Adhesion to an Epoxy Resin
Abstract
Microdendritic copper deposits of various morphologies were electrolytically produced and bonded with an epoxy resin. The adhesion strength and failure mode of the copper bond were evaluated by means of T-type peel tests and SEM, EDS surface analyses. The general effects of independent process parameters on deposit quality and adhesion were studied. It was found that microdendritic deposits of relatively high surface area and strength produced electrolytically improved adhesion between metal and polymeric adhesive through enhanced mechanical interlocking or anchoring.
Recommended Citation
B. K. Sun and T. J. O'Keefe, "Growth of Electrolytic Copper Dendrites and their Adhesion to an Epoxy Resin," Surface and Coatings Technology, vol. 106, no. 1, pp. 44 - 52, Elsevier, Jul 1998.
The definitive version is available at https://doi.org/10.1016/S0257-8972(98)00488-5
Department(s)
Materials Science and Engineering
Keywords and Phrases
Adhesion strength; Copper microdendrite; Deposit morphology; Limiting current density
International Standard Serial Number (ISSN)
0257-8972
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Elsevier, All rights reserved.
Publication Date
10 Jul 1998
