Examination of Copper Electrowinning Smoothing Agents. Part III. Chloride Interaction with HydroStar and Cyquest N-900

Abstract

Chloride ions and their interactions with two organic smoothing additives - Cyquest® N-900 and HydroStar® 4208 - during copper electrodeposition were explored using cyclic voltammetry and electrochemical impedance spectroscopy. The results revealed that chloride ions, up to a concentration of 40 mg/L, depolarized the copper deposition reaction. A combination of chloride ions and Cyquest N-900 inhibited the depolarization reaction during copper electrodeposition. It is proposed that the chloride ions acted as bridging ligands between copper and Cyquest N-900. Addition of HydroStar at a concentration of 2.5 mg/L depolarized the copper deposition reaction when no chloride ions were present. This behavior did not change with the addition of chloride ions at the concentrations tested, indicating that chloride ions and the polysaccharide do not interact.

Department(s)

Materials Science and Engineering

Keywords and Phrases

Chloride; Copper; Cyclic voltammetry; Cyquest N-900; Electrochemical impedance spectroscopy; Electrowinning; HydroStar

International Standard Serial Number (ISSN)

0747-9182

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Society for Mining, Metallurgy and Exploration, All rights reserved.

Publication Date

01 Feb 2016

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