Masters Theses

Keywords and Phrases

ADS; Conversion; CST; Electrostatic Discharge; SPICE Model; Transient Voltage Suppressor

Abstract

System efficient electrostatic design (SEED) combines full-wave geometry information with SPICE models of non-linear protection devices, typically transient voltage suppression (TVS) diodes, to allow optimization and validation of electrostatic design (ESD) protection early in the design process. TVS models have previously been developed which may be used in SPICE simulation tools like Keysight ADS, but these models could not be used directly in full-wave simulation tools like CST Studio. A process was developed for converting existing ADS models of TVS devices to a form that can be used within a CST full wave/SPICE hybrid simulation. Three TVS models were converted and validated. In isolated model tests, the results were nearly identical between CST and ADS for quasi-static and peak IV results, with minor amounts of error that are presumed to originate from mathematical differences in simulation solvers.

Designers may require many tuned TVS models for their simulations. Auto-tuners for non-snapback and SCR structure TVS models were developed to match measured quasi-static IV curves and automatically export CST compatible netlists. The non-snapback tuner was validated with repeatability tests consisting of five tuning trials across five different devices. The maximum averaged error across the five devices was 3.3% deviation from the measured curve. Across the five trials for each device, the average standard deviation was 0.55 (of averaged percent error). Simulations of the SCR-type TVS model show results within user specified margins of error for isolated IV characteristics, such as the linear resistance, holding voltage, and trigger voltage.

Advisor(s)

Beetner, Daryl G.

Committee Member(s)

Donnell, Kristen M.
Khilkevich, Victor

Department(s)

Electrical and Computer Engineering

Degree Name

M.S. in Electrical Engineering

Publisher

Missouri University of Science and Technology

Publication Date

Summer 2025

Journal article titles appearing in thesis/dissertation

Paper I, found on pages 3-41, is intended for submission to 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity.

Paper II, found on pages 42-62, is intended for submission to IEEE Letters on Electromagnetic Compatibility Practice and Applications.

Pagination

xiv, 66 pages

Note about bibliography

Includes_bibliographical_references_(page 65)

Rights

© 2025 Daniel Peter Szanto , All Rights Reserved

Document Type

Thesis - Open Access

File Type

text

Language

English

Thesis Number

T 12549

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