Masters Theses

Author

Yuan Chen

Keywords and Phrases

1X-Reflect SFD; 2X-Thru SFD; AITT; De-Embedding; D Probe

Abstract

"In section 1, the procedures of 1X-Reflect smart fixture de-embedding (SFD), 1-port auto fixture removal (AFR), and 2X-Thru SFD are compared from various perspectives: test fixture design, the de-embedding procedure, and de-embedded results. The accuracy of fixture characterization and the de-embedded result is the key figure of merit (FOM) in each de-embedding method. Full wave models are built to evaluate the FOM of the three methods, by comparing the scattering parameters (S-parameters) and time domain reflectometer (TDR). A test coupon for measuring USB-C cables is adopted to serve as a manufactured validation purpose.

In section 2, a physics-based circuit model for a novel differential probe without a nearby ground pin is built up to 20GHz. First, the SFD method is used to obtain the S-parameter of a differential probe in a full wave model to validate the effectiveness of this method. Second, real measurements are made to obtain the S-parameter of a differential probe. Furthermore, the one-to-one corresponding circuit model has been built to understand the physics of probes. A layout for the advance interconnect test tool (AITT) demo board is then designed to test probe characteristics and AITT software. Finally, the SFD method is applied to de-embed the test fixtures, and material information is extracted based on the de-embedded results"--Abstract, page iii.

Advisor(s)

Drewniak, James L.

Committee Member(s)

Fan, Jun, 1971-
Khilkevich, Victor

Department(s)

Electrical and Computer Engineering

Degree Name

M.S. in Electrical Engineering

Publisher

Missouri University of Science and Technology

Publication Date

Spring 2018

Pagination

ix, 51 pages

Note about bibliography

Includes bibliographical references (pages 47-50).

Rights

© 2018 Yuan Chen, All rights reserved.

Document Type

Thesis - Open Access

File Type

text

Language

English

Thesis Number

T 11273

Electronic OCLC #

1041858149

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