Masters Theses
Keywords and Phrases
3D-IC; Full-chip analysis
Abstract
"Through-silicon vias (TSVs) are subject to thermal fatigue due to stress over time, no matter how small the stress is. Existing works on TSV fatigue all rely on measurement-based parameters to estimate the lifetime, and cannot consider detailed thermal profiles. In this paper, we propose a new method for TSV fatigue prediction using entropy production during thermal cycles. By combining thermodynamics and mechanics laws, the fatigue process can be quantitatively evaluated with detailed thermal profiles. Experimental results show that interestingly, the landing pad possesses the most easy-to-fail region, which generates up to 50% more entropy compared with the TSV body. The impact of landing pad dimension and TSV geometries are also studied, providing guidance for reliability enhancement. Finally, full-chip fatigue analysis is performed based on stress superposition. To the best of the authors' knowledge, this is the first TSV fatigue model that is free of measurement data fitting, the first that is capable of considering detailed thermal profiles, and the first framework for efficient full-chip TSV fatigue analysis."--Abstract, page iii.
Advisor(s)
Shi, Yiyu
Committee Member(s)
Lim, Sung Kyu
Choi, Minsu
Department(s)
Electrical and Computer Engineering
Degree Name
M.S. in Computer Engineering
Publisher
Missouri University of Science and Technology
Publication Date
Spring 2015
Pagination
viii, 34 pages
Note about bibliography
Includes bibliographical references (pages 32-33).
Rights
© 2015 Tianchen Wang, All rights reserved.
Document Type
Thesis - Open Access
File Type
text
Language
English
Subject Headings
Three-dimensional integrated circuitsInterconnects (Integrated circuit technology) -- Design and constructionMetals -- Thermal fatigueEntropy
Thesis Number
T 10746
Electronic OCLC #
921182171
Recommended Citation
Wang, Tianchen, "A novel entropy production based full-chip TSV fatigue analysis" (2015). Masters Theses. 7426.
https://scholarsmine.mst.edu/masters_theses/7426