Masters Theses

Abstract

"The adhesive and sealant Industry has more than kept pace with our rapidly expanding technology of today. This growth has left the standardization of data on adhesives far behind and lack of this data is obvious. Of the many applications, particularly as related to space technology and energy conversion, the resistance to the flow of heat offered by the bond layer is of considerable importance.

Little information is available on the effect of adhesives on heat transfer. In connection with their work on honeycomb panels, Rankle, Gier, and Bevans (7) determined the thermal resistance of the particular type of adhesives used in their panels. The results of Barzelay, Tong, and Hollo on two other bonding materials are presented In (2). Other contributions have been made by Jansson (16) and Fried (10); each on a very limited number of bonding materials.

The present investigation was undertaken as a step in fulfilling the need for more data on the thermal effect of adhesive layers. This paper presents the results of experimental work conducted by the author on the thermal resistance of various adhesives between aluminum inter- faces. Effects of temperature level and curing pressure are demonstrated.

Figure 1 and the schematic diagram, Fig. 2, show the test apparatus used In this Investigation. Cylindrical bars of aluminum, cut, faced, and rejoined with the adhesive to be tested constituted the test specimens.

Heat was supplied at one end of the test specimen by a resistance heater and removed by an Ice bath at the other end. Three separately controlled guard heaters were employed to minimize radial losses from the test cylinder.

To determine heat flow In the specimen and temperature drop across the adhesive layer, thermocouples were located at six axial positions. Twelve additional thermocouples were used In surrounding Insulation for controlling the guard heaters.

Tests were conducted on epoxy thermoset, polyester thermoset, thermoplastic, and silicone rubber adhesives. Results of these tests In determining the thermal resistance of the adhesive layer are given In Tables 8 through 14. These tables show the effect of temperature level and curing pressure on the thermal resistance. Values for the thermal resistance of bare Interfaces are Included.

At a curing pressure of 1.25 psi, the thermal resistance ranged from 2.88 x 10-4 hr sq ft °F/Btu for polyester thermoset to 1.27 x 10-2 hr sq ft °F/Btu for the silicone rubber adhesive. For the adhesives tested, the thermal resistance of the bond layer was dependent on the curing pressure as a result of the change in thickness of the adhesive layer.

Comparison of the outputs of the heat meters located on each side of the bond indicate that side losses have been kept to less than 5% of the axial heat flow for all tests"--Summary, pages iii-v.

Advisor(s)

Sauer, Harry J., Jr., 1935-2008

Committee Member(s)

Scofield, Gordon L., 1925-1986
Joiner, James W., 1931-2013
Wolf, Robert V., 1929-1999

Department(s)

Mechanical and Aerospace Engineering

Degree Name

M.S. in Mechanical Engineering

Publisher

University of Missouri at Rolla

Publication Date

1964

Pagination

ix, 48 pages

Note about bibliography

Includes bibliographical references (pages 45-47).

Rights

© 1964 David Marion Lewis, All rights reserved.

Document Type

Thesis - Open Access

File Type

text

Language

English

Thesis Number

T 1552

Print OCLC #

5955107

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