Masters Theses
Keywords and Phrases
Friction stir process
Abstract
"The last decade has witnessed a strong technological thrust for manufacturing of micro-components. Polymers and ceramics have been replicated using micromolds, and are commercially used to produce microcomponents in large numbers. On the other hand, for demanding microsystems applications, metals are an attractive choice, for their mechanical and wear properties. Microforming of superplastic alloys has been investigated with good success. This thesis presents a novel technique of microforming using friction stir technology and superplastic materials science. The friction stir microforming process design, microdie design and experimental procedure are detailed. Superplastic Al-7075 and Al-Mg-Zr alloys have been microformed and characterized in this study. Comparison of formability and micro structure of superplastic Al-7075 versus non-superplastic Al-7075 alloy is also presented. Results of a conventional microforging experiment are compared with friction stir microforming. Finally, key issues pertaining to friction stir microforming are brought up and recommendations are made for future work in this field"--Abstract, page iii.
Advisor(s)
Mishra, Rajiv S.
Committee Member(s)
Allada, Venkat
Liou, Frank W.
Department(s)
Mechanical and Aerospace Engineering
Degree Name
M.S. in Manufacturing Engineering
Research Center/Lab(s)
Intelligent Systems Center
Publisher
University of Missouri--Rolla
Publication Date
Spring 2004
Pagination
viii, 40 pages
Note about bibliography
Includes bibliographical references (pages 37-39).
Rights
© 2004 Saurav Mohan, All rights reserved.
Document Type
Thesis - Restricted Access
File Type
text
Language
English
Subject Headings
Superplastic forming (Metal-work)
Thesis Number
T 8505
Print OCLC #
56827748
Recommended Citation
Mohan, Saurav, "Friction stir microforming of superplastic alloys" (2004). Masters Theses. 2539.
https://scholarsmine.mst.edu/masters_theses/2539
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Comments
Partial financial support provided for this work by Intelligent Systems Center, University of Missouri--Rolla is gratefully acknowledged.