Power Bus Decoupling on Multilayer Printed Circuit Boards

Todd H. Hubing, Missouri University of Science and Technology
James L. Drewniak, Missouri University of Science and Technology
Thomas Van Doren, Missouri University of Science and Technology
David M. Hockanson

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1211

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Abstract

Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus.