Comparing Physical and Cyber-Enhanced Dissection: An Analysis from Multiple Perspectives
Abstract
Product dissection has evolved into a versatile pedagogical platform useful across the engineering curriculum. With the advent of digital, cyber, haptic, virtual, and immersive technologies, the opportunities to implement product dissection as an instructional tool increase dramatically. However, the effectiveness of cyber-enhanced dissection must be studied and the advantages and limitations of each type of platform must be understood in the context of achieving educational outcomes. In this paper, we first outline the history of dissection and carefully delineate the difference between physical, virtual, and cyber-enhanced dissection. We then study the impact of variations of cyber-enhanced (a blend of physical and virtual) dissection across two populations of sophomore engineering students at two universities using a number of exercises and data collection methods. We report on student perceptions regarding the affordances and disadvantages of physical vs. cyber-enhanced dissection. Students perceived the cyberenhanced dissection exercises to be relevant to the students' own professional preparation, to facilitate easier dissemination, to better align with emerging industrial practices, and to provide unique experiences not available in other courses the students had taken. Some potential drawbacks of cyberenhanced dissection were also reported by students, including technology distracting them from the core educational objectives and overreliance on historical data of unknown origin. Although there are important tradeoffs between physical and cyber-enhanced dissection that need to be considered, using a blend of physical and virtual instructional tools may provide an effective platform to teach a wide range of engineering concepts across a curriculum.
Recommended Citation
K. Grantham et al., "Comparing Physical and Cyber-Enhanced Dissection: An Analysis from Multiple Perspectives," Proceedings of the 22nd ASME Design Engineering Technical Conference (2010, Montreal, QC, Canada), vol. 6, pp. 737 - 745, American Society of Mechanical Engineers (ASME), Aug 2010.
The definitive version is available at https://doi.org/10.1115/DETC2010-28350
Meeting Name
22nd International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2010 (2010: Aug. 15-18, Montreal, QC, Canada)
Department(s)
Engineering Management and Systems Engineering
Keywords and Phrases
Affordances; Data collection method; Educational objectives; Engineering concepts; Engineering curriculum; Historical data; Immersive technologies; Industrial practices; Instructional tool; Multiple perspectives; Product dissection; Sophomore engineering; Student perceptions, Curricula; Design; Population statistics; Students; Teaching, Manufacture
International Standard Book Number (ISBN)
978-0791844144
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 American Society of Mechanical Engineers (ASME), All rights reserved.
Publication Date
01 Aug 2010