Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2002: Aug. 19-23, Minneapolis, MN)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Whitney Elements; Dielectric Substrate; Electromagnetic Modeling; Finite Element Analysis; Higher-Order FEM Elements; Linear-Tangent/Linear-Normal Tangential Vector Finite Elements; Mesh Methods; Method Of Moments; Microstrip Lines; Microstrip Structures Analysis; Substrates; Boundary Conditions; Dielectric Materials; Electric Field Effects; Finite Difference Method; Finite Element Method; Mathematical Models; Printed Circuit Boards; Time Domain Analysis; Microstrip Structures; Microstrip Devices

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2002