Abstract
Investigation into the derivation of the dielectric property of a material with an embedded modulated PIN diode-loaded dipole is described, using an open-ended rectangular waveguide as the irradiating source. Previous measurements of the curing of a mortar specimen show the sensitivity of this combined technique and its potential for inspecting composite structures. Modification of previous algorithms for back calculating the dielectric properties of a material with a conductor backing is considered. The modification would involve replacing the reflection at the conductor with the reflection at a modulated dipole antenna. For this, comparisons between the reflection coefficients of the dipole antenna and an infinite conducting plate are made. These results are analyzed, and the necessary considerations are discussed.
Recommended Citation
D. M. Hughes and R. Zoughi, "A Method for Evaluating the Dielectric Properties of Composites using a Combined Embedded Modulated Scattering and Near-Field Microwave Nondestructive Testing Technique," Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference (2001, Budapest, Hungary), vol. 3, pp. 1882 - 1886, Institute of Electrical and Electronics Engineers (IEEE), May 2001.
The definitive version is available at https://doi.org/10.1109/IMTC.2001.929528
Meeting Name
18th IEEE Instrumentation and Measurement Technology Conference (2001: May 21-23, Budapest, Hungary)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Composite Materials; Composites; Conductor Backing; Dielectric Measurement; Dielectric Properties; Electromagnetic Wave Scattering; Embedded Modulated PIN Diode-Loaded Dipole; Embedded Modulated Scattering; Microwave Measurement; Microwave Nondestructive Testing; Near-Field Microwave NDT Technique; Nondestructive Testing; Open-Ended Rectangular Waveguide; Reflection Coefficients; Sensitivity
International Standard Book Number (ISBN)
780366468
International Standard Serial Number (ISSN)
1091-5281
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2001 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2001