A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2008: Aug. 18-22, Detroit, MI)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Model; Differential Signal; Ground Vias; Noise Coupling; Signal Via Transition; Via Capacitance; Integrated Circuit Modeling; Frequency Measurement; Capacitance; Geometry; Transmission Line Measurements; Dielectric Measurements; Stripline; SPICE; Microstrip Circuits; Printed Circuit Testing; S-Parameters

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)

2158-110X; 2158-1118

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2008