Corrigendum to “Advanced Techniques in Quartz Wafer Precision Processing: Stealth Dicing based on Filament-induced Laser Machining” [Opt. Laser Technol. 171 (2024) 110474] (Optics and Laser Technology (2024) 171, (S0030399223013671), (10.1016/j.optlastec.2023.110474))

Author

Yun Wang
Yutang Dai
Farhan Mumtaz, Missouri University of Science and TechnologyFollow
Kaiyan Luo

Abstract

The authors regret, that the affiliation for author Yun Wang was incomplete. To accurately reflect both the author's academic affiliation and the research platform where the work was conducted. The correct affiliation for Yun Wang is updated as above. The authors would like to apologize for any inconvenience caused.

Recommended Citation

Y. Wang et al., "Corrigendum to “Advanced Techniques in Quartz Wafer Precision Processing: Stealth Dicing based on Filament-induced Laser Machining” [Opt. Laser Technol. 171 (2024) 110474] (Optics and Laser Technology (2024) 171, (S0030399223013671), (10.1016/j.optlastec.2023.110474))," Optics and Laser Technology, vol. 196, article no. 114584, Elsevier, Apr 2026.

The definitive version is available at https://doi.org/10.1016/j.optlastec.2025.114584

Department(s)

Electrical and Computer Engineering

Publication Status

Free Access

Comments

National Natural Science Foundation of China, Grant 51975442

International Standard Serial Number (ISSN)

0030-3992

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2026 Elsevier, All rights reserved.

Publication Date

01 Apr 2026