Abstract
In automotive systems, a metal chassis protects the components against the external environment. However, the metal chassis is conductive, which results in unwanted conducted emission (CE) coupling to electric components. An inductor used for power factor correction (PFC) is one of the affected components. When the inductor is mated with the metal chassis, the impedance of the inductor changes. It is also hard to predict the CE coupling due to the structure-dependent characteristics. That is, the CE coupling is not negligible and hard to clarify. Therefore, this article proposes an efficient modeling method for the inductor which is mated with the metal chassis. The proposed method includes the measurements and optimization algorithm. The measurement setups include an impedance analyzer (IA) and a vector network analyzer (VNA). The IA is used to measure the accurate inductance value of the inductor, and the VNA is used to measure the coupling to a chassis. And the optimization algorithm includes the simulated annealing (SA). The equivalent models for the inductor, the inductor with 2D metal chassis, and the inductor with 3D metal chassis are introduced, respectively. The introduced equivalent models are well-matched to the measurements up to 100 MHz.
Recommended Citation
J. Park et al., "Measurement- and Simulated Annealing (SA) Optimization-Based Inductor Model Coupled to Chassis," IEEE Transactions on Instrumentation and Measurement, Institute of Electrical and Electronics Engineers, Jan 2025.
The definitive version is available at https://doi.org/10.1109/TIM.2025.3608334
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Conducted emission (CE); electromagnetic compatibility (EMC); impedance analyzer; inductor modeling; linear regression; simulated annealing (SA); vector network analyzer (VNA)
International Standard Serial Number (ISSN)
1557-9662; 0018-9456
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2025 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2025
