Abstract

Microneedles are getting more and more attention in research and commercialization since their advancement in the 1990s due to the advantages over traditional hypodermic needles such as minimum invasiveness, low material and fabrication cost, and precise needle geometry control, etc. The design and fabrication of microneedles depend on various factors such as the type of materials used, fabrication planes and techniques, needle structures, etc. In the past years, in‐plane and out‐of‐plane microneedle technologies made by silicon (Si), polymer, metal, and other materials have been developed for numerous biomedical applications including drug delivery, sample collections, medical diagnostics, and bio‐sensing. Among these microneedle technologies, in‐plane Si microneedles excel by the inherent properties of Si such as mechanical strength, wear resistance, biocompatibility, and structural advantages of in‐plane configuration such as a wide range of length, readiness of integration with other supporting components, and complementary metal‐oxide‐semiconductor (CMOS) compatible fabrication. This article aims to provide a review of in‐plane Si microneedles with a focus on fabrication techniques, theoretical and numerical analysis, experimental characterization of structural and fluidic behaviors, major applications, potential challenges, and future prospects.

Department(s)

Electrical and Computer Engineering

Publication Status

Open Access

Keywords and Phrases

CMOS compatible; drug delivery; in‐plane; microneedle; sample collection; sensing; silicon

International Standard Serial Number (ISSN)

2072-666X

Document Type

Article - Journal

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2025 The Authors, All rights reserved.

Creative Commons Licensing

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

Publication Date

01 May 2022

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