Abstract
This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.
Recommended Citation
J. Lee et al., "ESD Field Coupling Study in Relation with PCB GND and Metal Chassis," Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, 2009. EMC Zurich 2009, Institute of Electrical and Electronics Engineers (IEEE), Jan 2009.
The definitive version is available at https://doi.org/10.1109/EMCZUR.2009.4783413
Meeting Name
20th International Zurich Symposium on Electromagnetic Compatibility, 2009. EMC Zurich 2009
Department(s)
Electrical and Computer Engineering
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 2009
