Abstract
The use of a combined embedded modulated scattering technique, utilizing a PIN diode-loaded dipole probe, and near-field microwave nondestructive testing technique, utilizing an open-ended rectangular waveguide, has been investigated as a means for determining the complex dielectric constant in which the MST probe is embedded. For this, the formulation of the forward problem of calculating the modulated reflection coefficient, measured at the aperture of the waveguide, is presented here, This formulation is based upon the reciprocity theorem for two antennae, and utilizes the near-field radiation pattern of a rectangular waveguide aperture and current distribution along the length of a dipole antenna. This formulation is verified with measured values as a function of location, load impedance and surrounding media. Finally, potential improvements, considerations, and the use of an inversion routine is discussed.
Recommended Citation
D. M. Hughes and R. Zoughi, "Calculation of the Impedance of a Rectangular Waveguide Aperture in the Presence of a Loaded Dipole Antenna Embedded in a Generally Lossy Material," Proceedings of the 20th IEEE Instrumentation and Measurement Technology Conference (2003, Vail, CO), vol. 2, pp. 1126 - 1130, Institute of Electrical and Electronics Engineers (IEEE), May 2003.
The definitive version is available at https://doi.org/10.1109/IMTC.2003.1207929
Meeting Name
20th IEEE Information and Measurement Technology Conference (2003: May 20-22, Vail, CO)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Electric Impedance; Nondestructive Examination; Permittivity; Rectangular Waveguides; Theorem Proving; Dielectric Materials; Directional Patterns (Antenna); Probes; Scattering; Semiconductor Diodes; Testing; Waveguides; Lossy Materials; Dipole Antennas; Antenna Measurement; Antenna Theory; Aperture Antennas; Complex Dielectric Constant; Loaded Antennas; Microwave Non-Destructive Testing; Modulated Scattering Techniques; Near Field Radiation
International Standard Book Number (ISBN)
780377052
International Standard Serial Number (ISSN)
1091-5281
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2003 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2003