Abstract

A method of cascading 3D models and 2D models to model the full channel of ASIC package substrate interconnects is proposed, showing good match to full-wave results in S-parameter and TDR up to 100 GHz.

Department(s)

Electrical and Computer Engineering

Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases

2D cross section analysis; ASIC package substrate interconnects; cascaded S-parameters

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2025 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

01 Jan 2024

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