Abstract
A method of cascading 3D models and 2D models to model the full channel of ASIC package substrate interconnects is proposed, showing good match to full-wave results in S-parameter and TDR up to 100 GHz.
Recommended Citation
Z. Peng et al., "Cascading of 2D and 3D Simulations of ASIC Substrate Interconnect Up to 100 GHz," 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Institute of Electrical and Electronics Engineers, Jan 2024.
The definitive version is available at https://doi.org/10.1109/EPEPS61853.2024.10754397
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
2D cross section analysis; ASIC package substrate interconnects; cascaded S-parameters
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2025 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2024
Comments
National Science Foundation, Grant IIP-1916535