Abstract
This paper presents the study of the TM010 mode cylindrical resonator, which can be used for printed circuit board (PCB) material properties extraction, e.g., the dielectric constant (Dk) and the loss tangent (Df) extraction. The theoretical formulas of the resonance frequency and Q-factor of the resonator are presented. In real measurement, the TM010 mode cylindrical cavity resonator needs to be excited by the probe. The study emphasizes the impact of probe orientation, location, and field distribution on the accuracy of material property extraction. The relationship between cavity dimensions and resonance frequency is explored, highlighting the influence of cavity radius and height on material property characterization. Visual representations and simulations illustrate the significance of these dimensions in accurately determining Dk and Df. The paper also compares the efficiency of electric- (E-) and magnetic- (H-) probe feeding methods through full-wave simulations. Results indicate that the E probe exhibits superior accuracy, with relative errors below 0.2% for Dk and less than 2.2% for Df, while the H probe shows a relative error of 0.1% for Dk and 8% for Df. The presented analysis can help the development and the manufacture of the cavity resonator method, for characterizing the PCB material.
Recommended Citation
R. Asadi et al., "Design of the TM010 Mode Cylindrical Cavity Resonator for PCB Dielectric Characterization," IEEE International Symposium on Electromagnetic Compatibility, pp. 125 - 129, Institute of Electrical and Electronics Engineers, Jan 2024.
The definitive version is available at https://doi.org/10.1109/EMCSIPI49824.2024.10705488
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
cavity feeding; cavity resonator; Df; Dk; Electric probe; Magnetic probe; PCB material characterization; TM mode 010
International Standard Serial Number (ISSN)
2158-1118; 1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2024