Green On-chip Inductors for Three-dimensional Integrated Circuits: Concepts, Algorithms and Applications

Author

Umamaheswara Rao Tida
Cheng Zhuo
Yiyu Shi, Missouri University of Science and TechnologyFollow

Abstract

This chapter deals with a completely different aspect of circuit and design as compared to the previous chapters. This chapter discusses three-dimensional integrated circuits (3D ICs) as compared to the planner integrated circuits of the previous chapters. The 3D ICs have shown significant promise for the future post-CMOS era circuits and systems to build high-performance systems with minimal silicon foot print. This chapter specifically discusses practical approaches to through-silicon-via (TSV) inductors which constitute the vertical signal, power and thermal paths which is very critical for 3D ICs.

Recommended Citation

U. R. Tida et al., "Green On-chip Inductors for Three-dimensional Integrated Circuits: Concepts, Algorithms and Applications," Nano-CMOS and Post-CMOS Electronics: Circuits and Design, pp. 305 - 336, The Institute of Engineering and Technology, Jan 2016.

The definitive version is available at https://doi.org/10.1049/PBCS030E_ch10

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-178561000-4;978-184919999-5

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 The Institute of Engineering and Technology, All rights reserved.

Publication Date

01 Jan 2016