Abstract
Through-silicon-vias (TSVs) are the enabling technique for three-dimensional integrated circuits (3D ICs). However, their large area significantly reduces the benefits that can be obtained by 3D ICs. On the other hand, a major limiting factor for the implementation of many on-chip circuits such as DC-DC converters and resonant clocking is the large area overhead induced by spiral inductors. Several works have been proposed in the literature to make inductors out of idle TSVs. In this paper, we will demonstrate the effectiveness of such TSV inductors in addressing both challenges. Experimental results show that by replacing conventional spiral inductors with TSV inductors, the inductor area can be reduced by up to 4.3x and 7.7x for a single-phase buck converter design and an LC resonant clocking design respectively, under the same performance constraints.
Recommended Citation
U. R. Tida et al., ""green" On-chip Inductors in Three-dimensional Integrated Circuits," Proceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI, pp. 571 - 576, article no. 6903425, Institute of Electrical and Electronics Engineers, Sep 2014.
The definitive version is available at https://doi.org/10.1109/ISVLSI.2014.117
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-147993763-9
International Standard Serial Number (ISSN)
2159-3477; 2159-3469
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
18 Sep 2014
