Abstract
On-chip temperature and stress sensors are important for runtime system management techniques tackling thermomechanical reliability issues in 3-D integrated circuits (ICs). However, traditional temperature and stress sensor designs require large calibration overhead to improve accuracy, which incurs significant cost for massive production. To address the challenge, in this paper, we propose a novel temperature-stress cosensor design for 3-D ICs. By exploring the inherent reciprocity of temperature and stress mechanisms, it achieves runtime self-calibration such that no dedicated calibration effort is needed. Simulation results show that the cosensor achieves 0.26 C and 0.43 MPa accuracy on average in temperature and stress measurements, respectively, when evaluated in-60 C, 140 C}. In addition, the accuracy of self-calibrated sensors remains within 1.1 C} and 2.3 MPa when there exists up to 5% measurement noise, which shows that the self-calibration process is relatively insensitive to various noises.
Recommended Citation
C. Zhang et al., "Runtime Self-calibrated Temperature-stress Cosensor for 3-D Integrated Circuits," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 22, no. 11, pp. 2411 - 2417, article no. 6675079, Institute of Electrical and Electronics Engineers, Nov 2014.
The definitive version is available at https://doi.org/10.1109/TVLSI.2013.2290132
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Self-calibration; temperature-stress cosensor; thermomechanical reliability.
International Standard Serial Number (ISSN)
1063-8210
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Nov 2014
Comments
National Science Foundation, Grant 1337167