Fully Analytical Methodology for Fast End-to-end Link Analysis on Complex Printed Circuit Boards Including Signal and Power Integrity Effects
Abstract
High speed printed circuit boards (PCBs) can be extremely complex with a large number of via structures and transmission lines. Rapid analysis of on-board high speed nets including the non-TEM effects of vias with full-wave electromagnetic field solvers has been unrealistic. However, using a systematic, cascaded analytical approach, these high speed nets can now be analyzed quick enough to do design discovery and optimization during the pre-layout phase. the self assembly of the cascaded link path, using analytical models for each individual portion, allows this analysis to be performed in very short time, replacing the time consuming traditional full wave simulation techniques without sacrificing accuracy.
Recommended Citation
X. Gu and F. De Paulis and R. Rimolo-Donadio and K. Shringarpure and Y. Zhang and B. Archambeault and S. Connor and Y. H. Kwark and M. B. Ritter and J. Fan and C. Schuster, "Fully Analytical Methodology for Fast End-to-end Link Analysis on Complex Printed Circuit Boards Including Signal and Power Integrity Effects," Designcon 2009, vol. 3, pp. 1450 - 1467, Curran Associates, Inc., Dec 2009.
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-161567049-9
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Curran Associates, Inc., All rights reserved.
Publication Date
01 Dec 2009
